Intel Xeon Silver 4114 2.2Ghz BOX

Ofrezca computación en nube, análisis en tiempo real, procesamiento para sus negocios más importantes y perspectivas de macrodatos. Mejore la eficacia y confiabilidad del centro de datos para manejar cualquier carga de trabajo.

General information

• Type CPU / Microprocessor
• Market segment Server
• Family Intel Xeon Silver
• Model number 4114
• Frequency  2200 MHz
• Maximum turbo frequency 3000 MHz
• Bus speed  9.6 GT/s UPI
• Clock multiplier  22
• Package 3647-land Flip-Chip Land Grid Array (FC-LGA)
• Socket Socket 3647 / P0 / LGA3647-0
• Size 2.99" x 2.22" / 7.6cm x 5.65cm
• Fan/heatsink 1U form factor

Architecture / Microarchitecture

• Microarchitecture Skylake
• Platform Purley
• Processor core  Skylake-SP
• Core stepping  U0 (QN0B, SR3GK)
• CPUID 50654 (QN0B)
• Manufacturing process 0.014 micron
• Die LCC type
• Data width 64 bit
• The number of CPU cores 10
• The number of threads 20
• Floating Point Unit Integrated
• Level 1 cache size
  • 10 x 32 KB instruction caches
  • 10 x 32 KB data caches
• Level 2 cache size  10 x 1 MB caches
• Level 3 cache size 13.75 MB non-inclusive shared cache
• Physical memory 768 GB
• Multiprocessing Up to 2 processors
• Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • AVX-512 / Advanced Vector Extensions 512
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
  • Low power features Enhanced SpeedStep technology
• Integrated peripherals / components
• Integrated graphics None
• Memory controller
  • The number of controllers: 2
  • Memory channels per controller: 3
  • Supported memory: DDR4-2400
  • DIMMs per channel: 2
  • ECC supported: Yes
• Other peripherals
  • Ultra Path Interconnect (2 links)
  • PCI Express 3.0 interface (48 lanes)
  • Direct Media Interface 3.0 (4 lanes)
• Electrical / Thermal parameters
  • Maximum operating temperature  78°C (case temperature)
  • 89°C (Digital Thermal Sensor)
• Thermal Design Power  85 Watt